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Annealing of a Vacancy-Type Defect and Diffusion of Implanted Boron in 6H-SiC

  • T. Ohshima
  • , A. Uedono
  • , O. Eryu
  • , K. K. Lee
  • , K. Abe
  • , H. Itoh
  • , K. Nakashima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We have investigated the annealing of vacancy-type defects and B diffusion in SiC using positron annihilation spectroscopy (PAS) and secondary ion mass spectroscopy (SIMS). Boron (B) and carbon (C) ions were implanted into 6H-SiC substrates, and the samples were annealed up to 1650 °C in Ar. In the PAS study, defective layer to a depth of 200 nm from the surface is observed after annealing between 800 and 1200 °C. This region disappears after annealing above 1500 °C. No significant difference in the annealing behavior of the vacancy-type defects is observed for only B-and C/B-implanted samples. In the SIMS study, the out-diffusion of B in 6H-SiC is observed after annealing above 1400 °C and a dip in the B concentration is created close to the surface. This out-diffusion of B is suppressed by C/B-implantation. This suppression tends to be enhanced by the temperature of the implantation and the concentration of the implanted C.

Original languageEnglish
Title of host publicationMaterials Science Forum
EditorsPeder Bergman, Erik Janzén
PublisherTrans Tech Publications Ltd
Pages633-636
Number of pages4
ISBN (Print)9780878499205
DOIs
Publication statusPublished - 2003
Externally publishedYes
EventProceedings of the 4th European Conference on Silicon Carbide and Related Materials - Linkoping, Sweden
Duration: 02-09-2002 → 05-09-2002

Publication series

NameMaterials Science Forum
Volume433-436
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

ConferenceProceedings of the 4th European Conference on Silicon Carbide and Related Materials
Country/TerritorySweden
CityLinkoping
Period02-09-02 → 05-09-02

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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