TY - GEN
T1 - Automated solder inspection method by means of X-ray oblique computed tomography
AU - Teramoto, Atsushi
AU - Murakoshi, Takayuki
AU - Tsuzaka, Masatoshi
AU - Fujita, Hiroshi
PY - 2007
Y1 - 2007
N2 - High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed and reliable inspection technique for their solder joints. In this paper, we propose an automated X-ray inspection technique for BGA mounted substrate based on oblique computed tomography (OCT). Automated inspection consists of OCT capturing, position adjustment, bump extraction, character extraction and judgment. We proposed five characteristic features related to the bump shape. Moreover, by combining the characteristic features using artificial neural network, the condition of a solder bump was determined. In the experiments, we evaluate these techniques using actual BGA-mounted substrate. As a result, the correct rate of judgment reached 99.7%, which shows the clearly indicates that our method may be useful in the practice.
AB - High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed and reliable inspection technique for their solder joints. In this paper, we propose an automated X-ray inspection technique for BGA mounted substrate based on oblique computed tomography (OCT). Automated inspection consists of OCT capturing, position adjustment, bump extraction, character extraction and judgment. We proposed five characteristic features related to the bump shape. Moreover, by combining the characteristic features using artificial neural network, the condition of a solder bump was determined. In the experiments, we evaluate these techniques using actual BGA-mounted substrate. As a result, the correct rate of judgment reached 99.7%, which shows the clearly indicates that our method may be useful in the practice.
UR - http://www.scopus.com/inward/record.url?scp=48149101442&partnerID=8YFLogxK
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U2 - 10.1109/ICIP.2007.4379858
DO - 10.1109/ICIP.2007.4379858
M3 - Conference contribution
AN - SCOPUS:48149101442
SN - 1424414377
SN - 9781424414376
T3 - Proceedings - International Conference on Image Processing, ICIP
SP - V433-V436
BT - 2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings
PB - IEEE Computer Society
T2 - 14th IEEE International Conference on Image Processing, ICIP 2007
Y2 - 16 September 2007 through 19 September 2007
ER -