Automated solder inspection method by means of X-ray oblique computed tomography

Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed and reliable inspection technique for their solder joints. In this paper, we propose an automated X-ray inspection technique for BGA mounted substrate based on oblique computed tomography (OCT). Automated inspection consists of OCT capturing, position adjustment, bump extraction, character extraction and judgment. We proposed five characteristic features related to the bump shape. Moreover, by combining the characteristic features using artificial neural network, the condition of a solder bump was determined. In the experiments, we evaluate these techniques using actual BGA-mounted substrate. As a result, the correct rate of judgment reached 99.7%, which shows the clearly indicates that our method may be useful in the practice.

Original languageEnglish
Title of host publication2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings
PublisherIEEE Computer Society
Volume5
ISBN (Print)1424414377, 9781424414376
DOIs
Publication statusPublished - 01-01-2007
Externally publishedYes
Event14th IEEE International Conference on Image Processing, ICIP 2007 - San Antonio, TX, United States
Duration: 16-09-200719-09-2007

Other

Other14th IEEE International Conference on Image Processing, ICIP 2007
CountryUnited States
CitySan Antonio, TX
Period16-09-0719-09-07

Fingerprint

Ball grid arrays
Soldering alloys
Tomography
Inspection
X rays
Substrates
Electronic equipment
Railroad cars
Neural networks
Communication
Experiments

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Teramoto, A., Murakoshi, T., Tsuzaka, M., & Fujita, H. (2007). Automated solder inspection method by means of X-ray oblique computed tomography. In 2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings (Vol. 5). [4379858] IEEE Computer Society. https://doi.org/10.1109/ICIP.2007.4379858
Teramoto, Atsushi ; Murakoshi, Takayuki ; Tsuzaka, Masatoshi ; Fujita, Hiroshi. / Automated solder inspection method by means of X-ray oblique computed tomography. 2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings. Vol. 5 IEEE Computer Society, 2007.
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Teramoto, A, Murakoshi, T, Tsuzaka, M & Fujita, H 2007, Automated solder inspection method by means of X-ray oblique computed tomography. in 2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings. vol. 5, 4379858, IEEE Computer Society, 14th IEEE International Conference on Image Processing, ICIP 2007, San Antonio, TX, United States, 16-09-07. https://doi.org/10.1109/ICIP.2007.4379858

Automated solder inspection method by means of X-ray oblique computed tomography. / Teramoto, Atsushi; Murakoshi, Takayuki; Tsuzaka, Masatoshi; Fujita, Hiroshi.

2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings. Vol. 5 IEEE Computer Society, 2007. 4379858.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Teramoto A, Murakoshi T, Tsuzaka M, Fujita H. Automated solder inspection method by means of X-ray oblique computed tomography. In 2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings. Vol. 5. IEEE Computer Society. 2007. 4379858 https://doi.org/10.1109/ICIP.2007.4379858