Development of an automated X-ray inspection method for microsolder bumps

Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

BOA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for micro-solder bumps using an X-ray image. The thickness, area, volume, and void of the solder bumps were automatically inspected by this method. We introduced some correction techniques to reduce the effects of variation in the X-ray intensity and the spatial non-uniformity in the image. In this experiment, we evaluated accuracy and repeatability. The results demonstrated that the accuracy and repeatability met the requirement for online inspection. In conclusion, our automated method for inspecting micro-solder bumps may be useful in practice.

Original languageEnglish
Title of host publicationProceedings - EMAP 2005
Subtitle of host publication2005 International Symposium on Electronics Materials and Packaging
Pages21-26
Number of pages6
Volume2005
DOIs
Publication statusPublished - 01-12-2005
Externally publishedYes
EventEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
Duration: 11-12-200514-12-2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
CountryJapan
CityTokyo
Period11-12-0514-12-05

Fingerprint

Soldering alloys
Inspection
X rays
Printed circuit boards
Quality control
Experiments

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Teramoto, A., Murakoshi, T., Tsuzaka, M., & Fujita, H. (2005). Development of an automated X-ray inspection method for microsolder bumps. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (Vol. 2005, pp. 21-26). [1598229] https://doi.org/10.1109/EMAP.2005.1598229
Teramoto, Atsushi ; Murakoshi, Takayuki ; Tsuzaka, Masatoshi ; Fujita, Hiroshi. / Development of an automated X-ray inspection method for microsolder bumps. Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. pp. 21-26
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Teramoto, A, Murakoshi, T, Tsuzaka, M & Fujita, H 2005, Development of an automated X-ray inspection method for microsolder bumps. in Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. vol. 2005, 1598229, pp. 21-26, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, Tokyo, Japan, 11-12-05. https://doi.org/10.1109/EMAP.2005.1598229

Development of an automated X-ray inspection method for microsolder bumps. / Teramoto, Atsushi; Murakoshi, Takayuki; Tsuzaka, Masatoshi; Fujita, Hiroshi.

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005 2005. p. 21-26 1598229.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - BOA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for micro-solder bumps using an X-ray image. The thickness, area, volume, and void of the solder bumps were automatically inspected by this method. We introduced some correction techniques to reduce the effects of variation in the X-ray intensity and the spatial non-uniformity in the image. In this experiment, we evaluated accuracy and repeatability. The results demonstrated that the accuracy and repeatability met the requirement for online inspection. In conclusion, our automated method for inspecting micro-solder bumps may be useful in practice.

AB - BOA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for micro-solder bumps using an X-ray image. The thickness, area, volume, and void of the solder bumps were automatically inspected by this method. We introduced some correction techniques to reduce the effects of variation in the X-ray intensity and the spatial non-uniformity in the image. In this experiment, we evaluated accuracy and repeatability. The results demonstrated that the accuracy and repeatability met the requirement for online inspection. In conclusion, our automated method for inspecting micro-solder bumps may be useful in practice.

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Teramoto A, Murakoshi T, Tsuzaka M, Fujita H. Development of an automated X-ray inspection method for microsolder bumps. In Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. 2005. p. 21-26. 1598229 https://doi.org/10.1109/EMAP.2005.1598229