TY - GEN
T1 - Development of Hollow Typed Microneedles Patch with Continuous Glucose Monitoring Sensor Based on Polylactic Acid
AU - Zhou, Shicheng
AU - Chino, Yutaro
AU - Kasama, Toshihiro
AU - Miyake, Ryo
AU - Sato, Takehiro
AU - Mitsuzawa, Shigenobu
AU - Takai, Madoka
N1 - Publisher Copyright:
© 2023 IEEJ.
PY - 2023
Y1 - 2023
N2 - The emerging use of microneedles (MNs)-based electrochemical sensors presents an intriguing minimally invasive approach for real-time monitoring of analytes in the interstitial fluid (ISF). However, maintaining biocompatibility and preventing biofouling of the electrodes remain significant obstacles to their widespread adoption. In this study, we fabricated a biocompatible polylactic acid (PLA) hollow-shaped MNs patch for transdermal ISF extraction for the first time. Additionally, we employed cyanide-free electroless gold plating to realize high-quality Au metallization of PLA with excellent stability and electrochemical performance. Furthermore, an enzyme containing redox polymer hydrogel with antifouling nature was realized on PLA/Au towards safely high-sensitive continuous glucose monitoring.
AB - The emerging use of microneedles (MNs)-based electrochemical sensors presents an intriguing minimally invasive approach for real-time monitoring of analytes in the interstitial fluid (ISF). However, maintaining biocompatibility and preventing biofouling of the electrodes remain significant obstacles to their widespread adoption. In this study, we fabricated a biocompatible polylactic acid (PLA) hollow-shaped MNs patch for transdermal ISF extraction for the first time. Additionally, we employed cyanide-free electroless gold plating to realize high-quality Au metallization of PLA with excellent stability and electrochemical performance. Furthermore, an enzyme containing redox polymer hydrogel with antifouling nature was realized on PLA/Au towards safely high-sensitive continuous glucose monitoring.
KW - Glucose Monitoring
KW - Hollow Microneedles
KW - Polylactic Acid
KW - Zwitterionic Polymer
UR - https://www.scopus.com/pages/publications/85193491105
UR - https://www.scopus.com/pages/publications/85193491105#tab=citedBy
M3 - Conference contribution
AN - SCOPUS:85193491105
T3 - 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
SP - 18
EP - 21
BT - 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Y2 - 25 June 2023 through 29 June 2023
ER -