With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.
|Number of pages||4|
|Journal||Journal of Japan Institute of Electronics Packaging|
|Publication status||Published - 1998|
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering