Abstract
With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.
| Original language | English |
|---|---|
| Pages (from-to) | 68-71 |
| Number of pages | 4 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 4 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1998 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering