High Speed and High Precision Solder Bump Inspection Method Using X-ray Fluoroscopy

Atsushi Teramoto, Takayuki Murakoshi, Isao Horiba

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This paper proposes a technique to inspect the bump height, area and volume of solder bump using X-ray fluoroscopy. Since X-ray fluoroscopy can acquire the 2-dimensional signal proportional to the thickness of a solder, it is expectable to measure a solder bump with high precision and at high speed. We introduced some image processing method to correct unevenness of image. Furthermore we introduced X-ray monitor in order to decrease the effect of X-ray fluctuation. As a result, fluctuation decrease more than 50% than without X-ray monitor. By compare to the optical measurement method, this method shows advantageous result at the viewpoint of bump coverage area and inspection speed.

Original languageEnglish
Pages (from-to)652-658
Number of pages7
JournalIEEJ Transactions on Industry Applications
Volume125
Issue number6
DOIs
Publication statusPublished - 01-09-2005

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All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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