High speed oblique CT system for solder bump inspection

Atsushi Teramoto, Muneo Yamada, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The high-density LSI packages such as BGA (ball grid array) and CSP (chip scale package) are widely used in the electrical products. Solder bump is used as an electrical junction of these packages, and they cannot be observed from outside. X-ray fluoroscopy is used as inspection method. It cannot evaluate the shape of solder bump correctly because information is compressed along the ray. The oblique CT is considered as a method for accurately examining the shape of the solder bump. Conventional oblique CT still has the speed and mechanical constraint, and it cannot be introduced into the soldering line. In this paper, we propose the novel oblique CT system that can non-destructively obtain the 3D shape of solder bump at a high-speed. This system obtains the projection images from various directions using the rotational transfer of flat panel detector and the fixed mounted open-type X-ray generator that has a wide radiation angle, and reconstructs 3D image using the 3D FBP (Filtered Back Projection) method. In addition, we have developed the reconstruction acceleration unit for oblique CT, and thus the 3D image is obtained in the real time. In our experiments, we evaluated the solder joints of BGA mounted substrate. The result demonstrated that the proposed system obtained the information that was able to determine the good or defective situation in soldering. This system is the world's first CT system, which can be introduced into the soldering line, and it is operated by more than 20 domestic and foreign factories now.

Original languageEnglish
Title of host publicationProceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
Pages2689-2693
Number of pages5
DOIs
Publication statusPublished - 01-12-2007
Externally publishedYes
Event33rd Annual Conference of the IEEE Industrial Electronics Society, IECON - Taipei, Taiwan, Province of China
Duration: 05-11-200708-11-2007

Other

Other33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
CountryTaiwan, Province of China
CityTaipei
Period05-11-0708-11-07

Fingerprint

Soldering alloys
Inspection
Soldering
Ball grid arrays
Chip scale packages
X rays
Industrial plants
Detectors
Radiation
Substrates
Experiments

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Teramoto, A., Yamada, M., Murakoshi, T., Tsuzaka, M., & Fujita, H. (2007). High speed oblique CT system for solder bump inspection. In Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON (pp. 2689-2693). [4460065] https://doi.org/10.1109/IECON.2007.4460065
Teramoto, Atsushi ; Yamada, Muneo ; Murakoshi, Takayuki ; Tsuzaka, Masatoshi ; Fujita, Hiroshi. / High speed oblique CT system for solder bump inspection. Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. 2007. pp. 2689-2693
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abstract = "The high-density LSI packages such as BGA (ball grid array) and CSP (chip scale package) are widely used in the electrical products. Solder bump is used as an electrical junction of these packages, and they cannot be observed from outside. X-ray fluoroscopy is used as inspection method. It cannot evaluate the shape of solder bump correctly because information is compressed along the ray. The oblique CT is considered as a method for accurately examining the shape of the solder bump. Conventional oblique CT still has the speed and mechanical constraint, and it cannot be introduced into the soldering line. In this paper, we propose the novel oblique CT system that can non-destructively obtain the 3D shape of solder bump at a high-speed. This system obtains the projection images from various directions using the rotational transfer of flat panel detector and the fixed mounted open-type X-ray generator that has a wide radiation angle, and reconstructs 3D image using the 3D FBP (Filtered Back Projection) method. In addition, we have developed the reconstruction acceleration unit for oblique CT, and thus the 3D image is obtained in the real time. In our experiments, we evaluated the solder joints of BGA mounted substrate. The result demonstrated that the proposed system obtained the information that was able to determine the good or defective situation in soldering. This system is the world's first CT system, which can be introduced into the soldering line, and it is operated by more than 20 domestic and foreign factories now.",
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Teramoto, A, Yamada, M, Murakoshi, T, Tsuzaka, M & Fujita, H 2007, High speed oblique CT system for solder bump inspection. in Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON., 4460065, pp. 2689-2693, 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON, Taipei, Taiwan, Province of China, 05-11-07. https://doi.org/10.1109/IECON.2007.4460065

High speed oblique CT system for solder bump inspection. / Teramoto, Atsushi; Yamada, Muneo; Murakoshi, Takayuki; Tsuzaka, Masatoshi; Fujita, Hiroshi.

Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. 2007. p. 2689-2693 4460065.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Teramoto A, Yamada M, Murakoshi T, Tsuzaka M, Fujita H. High speed oblique CT system for solder bump inspection. In Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. 2007. p. 2689-2693. 4460065 https://doi.org/10.1109/IECON.2007.4460065