Abstract
When a diamond grinding wheel is used to create the cutting edge of a carbide tool, it induces latent flaws in the tool material. We developed a fixed abrasive wheel for solid phase chemical-mechanical polishing (SPCMP) and successfully sharpened the cutting edge of cemented carbide (WC-Co) tools while removing the latent flaws on the cutting edge. X-ray diffraction and electron backscattering diffraction measurements revealed that the SPCMP method removes latent scratches from the surfaces of WC-Co materials. Further, it can remove latent scratches introduced by the diamond wheel on the cutting edge of WC-Co tools, thus reducing the wear rate and extending their service life, as verified by conducting cutting experiments on Ti-6Al-4V and Inconel 718. Thin-film X-ray diffraction measurements using synchrotron light revealed that the processing strain on the surfaces of Ti-6Al-4V and Inconel 718 machined by the WC-Co cutting tool with SPCMP processing was extremely small when compared with the processing strain in the case without SPCMP processing.
| Original language | English |
|---|---|
| Pages (from-to) | 606-615 |
| Number of pages | 10 |
| Journal | Journal of Materials Research and Technology |
| Volume | 20 |
| DOIs | |
| Publication status | Published - 09-2022 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Biomaterials
- Surfaces, Coatings and Films
- Metals and Alloys
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