Abstract
We have succeeded in pulsed laser annealing of N+ ion-implanted n-type 6H-SiC for increasing the carrier density near surface in order to decrease contact resistance, which induces little redistribution of implanted impurities after laser irradiation. By repeated laser irradiation at low energy density, the ion-implanted impurities were electrically activated without melting the surface region. SiC substrates with impurity concentration of 2×1018/cm3 were implanted with 30 keV N+ ions with dose of 4.7×1013/cm2. After pulsed laser annealing, a contact resistance was measured to be 5.7×10-5 Ωm2 using Al electrode on the N+-implanted layer.
| Original language | English |
|---|---|
| Pages (from-to) | H5.31.1-H5.31.6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 640 |
| Publication status | Published - 2001 |
| Externally published | Yes |
| Event | Silicon Carbide- Materials, Processing and Devices - Boston, MA, United States Duration: 27-11-2000 → 29-11-2000 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering