Inspection technique of foreign objects in BGA solder joint using oblique X-ray computed tomography

Kenji Noguchi, Atsushi Teramoto, Muneo Yamada, Takayuki Murakoshi

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Foreign objects in a solder joint could deteriorate the joint strength when mounting BGA (Ball Grid Array) packages or CSP (Chip Scale Package) on printed circuit boards. However, foreign objects within solder bumps are not detected by optical inspection which has been used widely. Recently, X-ray computed tomography (CT) for the inspection of printed circuit boards has been developed. X-ray CT visualizes the foreign objects inside a solder joint. If they are automatically detected, higher soldering quality is expected. In this paper, we propose an automated detection method of foreign objects in solder joints using CT slice images. In the method, some characteristic values are identified which show the solder joint deformation. In the experiments, actual mounting substrates involving solder bumps contaminated by foreign objects were checked using the proposed method. The detection accuracy rate reached 98.9%, which clearly indicates that the proposed method is useful in practice.

Original languageEnglish
Pages (from-to)63-70
Number of pages8
JournalJournal of Japan Institute of Electronics Packaging
Volume13
Issue number1
DOIs
Publication statusPublished - 01-01-2010

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Ball grid arrays
Soldering alloys
Tomography
Inspection
X rays
Mountings
Printed circuit boards
Chip scale packages
Soldering
Substrates
Experiments

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

@article{52ef49c415a543e68019ff4b317e78ac,
title = "Inspection technique of foreign objects in BGA solder joint using oblique X-ray computed tomography",
abstract = "Foreign objects in a solder joint could deteriorate the joint strength when mounting BGA (Ball Grid Array) packages or CSP (Chip Scale Package) on printed circuit boards. However, foreign objects within solder bumps are not detected by optical inspection which has been used widely. Recently, X-ray computed tomography (CT) for the inspection of printed circuit boards has been developed. X-ray CT visualizes the foreign objects inside a solder joint. If they are automatically detected, higher soldering quality is expected. In this paper, we propose an automated detection method of foreign objects in solder joints using CT slice images. In the method, some characteristic values are identified which show the solder joint deformation. In the experiments, actual mounting substrates involving solder bumps contaminated by foreign objects were checked using the proposed method. The detection accuracy rate reached 98.9{\%}, which clearly indicates that the proposed method is useful in practice.",
author = "Kenji Noguchi and Atsushi Teramoto and Muneo Yamada and Takayuki Murakoshi",
year = "2010",
month = "1",
day = "1",
doi = "10.5104/jiep.13.63",
language = "English",
volume = "13",
pages = "63--70",
journal = "Journal of Japan Institute of Electronics Packaging",
issn = "1343-9677",
publisher = "The Japan Institute of Electronics Packaging",
number = "1",

}

Inspection technique of foreign objects in BGA solder joint using oblique X-ray computed tomography. / Noguchi, Kenji; Teramoto, Atsushi; Yamada, Muneo; Murakoshi, Takayuki.

In: Journal of Japan Institute of Electronics Packaging, Vol. 13, No. 1, 01.01.2010, p. 63-70.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Inspection technique of foreign objects in BGA solder joint using oblique X-ray computed tomography

AU - Noguchi, Kenji

AU - Teramoto, Atsushi

AU - Yamada, Muneo

AU - Murakoshi, Takayuki

PY - 2010/1/1

Y1 - 2010/1/1

N2 - Foreign objects in a solder joint could deteriorate the joint strength when mounting BGA (Ball Grid Array) packages or CSP (Chip Scale Package) on printed circuit boards. However, foreign objects within solder bumps are not detected by optical inspection which has been used widely. Recently, X-ray computed tomography (CT) for the inspection of printed circuit boards has been developed. X-ray CT visualizes the foreign objects inside a solder joint. If they are automatically detected, higher soldering quality is expected. In this paper, we propose an automated detection method of foreign objects in solder joints using CT slice images. In the method, some characteristic values are identified which show the solder joint deformation. In the experiments, actual mounting substrates involving solder bumps contaminated by foreign objects were checked using the proposed method. The detection accuracy rate reached 98.9%, which clearly indicates that the proposed method is useful in practice.

AB - Foreign objects in a solder joint could deteriorate the joint strength when mounting BGA (Ball Grid Array) packages or CSP (Chip Scale Package) on printed circuit boards. However, foreign objects within solder bumps are not detected by optical inspection which has been used widely. Recently, X-ray computed tomography (CT) for the inspection of printed circuit boards has been developed. X-ray CT visualizes the foreign objects inside a solder joint. If they are automatically detected, higher soldering quality is expected. In this paper, we propose an automated detection method of foreign objects in solder joints using CT slice images. In the method, some characteristic values are identified which show the solder joint deformation. In the experiments, actual mounting substrates involving solder bumps contaminated by foreign objects were checked using the proposed method. The detection accuracy rate reached 98.9%, which clearly indicates that the proposed method is useful in practice.

UR - http://www.scopus.com/inward/record.url?scp=84876911599&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84876911599&partnerID=8YFLogxK

U2 - 10.5104/jiep.13.63

DO - 10.5104/jiep.13.63

M3 - Article

VL - 13

SP - 63

EP - 70

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

SN - 1343-9677

IS - 1

ER -