Abstract
An X-ray computed tomography (CT) apparatus is required for the inspection of semiconductor packages to detect fine voids with high accuracy. However, obtaining high-quality CT images stably is difficult because of object misalignment. In this paper, we propose a method for improving the X-ray CT image quality by estimating the mechanical misalignment of each projection image. The estimation is conducted by using an iterative method based on the characteristic features obtained from the reconstructed image. In experiments, we verified the effectiveness of proposed method by using projection images with simulated misalignments added. The results indicated that the proposed method may be useful for improving the quality of CT imaging.
Original language | English |
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Pages (from-to) | 213-219 |
Number of pages | 7 |
Journal | IEEJ Transactions on Industry Applications |
Volume | 137 |
Issue number | 3 |
DOIs | |
Publication status | Published - 01-01-2017 |
All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering