The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography

Atsushi Teramoto, Muneo Yamada, Takayuki Murakoshi, Masatoshi Tsukada, Hiroshi Fujita

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)528-532
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Issue number7
Publication statusPublished - 2007
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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