The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography

Atsushi Teramoto, Muneo Yamada, Takayuki Murakoshi, Masatoshi Tsukada, Hiroshi Fujita

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)528-532
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Volume10
Issue number7
DOIs
Publication statusPublished - 01-01-2007
Externally publishedYes

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Tomography
Packaging
Substrates

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Teramoto, Atsushi ; Yamada, Muneo ; Murakoshi, Takayuki ; Tsukada, Masatoshi ; Fujita, Hiroshi. / The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography. In: Journal of Japan Institute of Electronics Packaging. 2007 ; Vol. 10, No. 7. pp. 528-532.
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The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography. / Teramoto, Atsushi; Yamada, Muneo; Murakoshi, Takayuki; Tsukada, Masatoshi; Fujita, Hiroshi.

In: Journal of Japan Institute of Electronics Packaging, Vol. 10, No. 7, 01.01.2007, p. 528-532.

Research output: Contribution to journalArticle

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