The atomic step induced by off angle CMP influences the electrical properties of the SiC surface

Yayoi Tanaka, Takao Kanda, Kazuyuki Nagatoshi, Masamichi Yoshimura, Osamu Eryu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this work, we made an off-axis surface of SiC with the chemical-mechanical polishing (CMP) method to examine the influence of an atomic step on the electronic properties of devices. Low energy ion scattering spectroscopy (LEISS) shows the Si-face and C-face with SiC structure on the polished SiC monocrystal. We considered that the atomic step on the surface influenced device properties, especially the leakage current of a Schottky diode. C atoms at the step and terrace, which generated the leakage current at the metal-semiconductor interface of a Schottky diode, have been clarified by conductive atomic force microscopy (CAFM).

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials 2011, ICSCRM 2011
EditorsRobert P. Devaty, Michael Dudley, T. Paul Chow, Philip G. Neudeck
PublisherTrans Tech Publications Ltd
Pages569-572
Number of pages4
ISBN (Print)9783037854198
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011 - Cleveland, OH, United States
Duration: 11-09-201116-09-2011

Publication series

NameMaterials Science Forum
Volume717-720
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference14th International Conference on Silicon Carbide and Related Materials 2011, ICSCRM 2011
Country/TerritoryUnited States
CityCleveland, OH
Period11-09-1116-09-11

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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