TY - GEN
T1 - Arrayed Electrical Stimulation Platform for Accurate Evaluation of Contractile Force of Ring-Shaped Engineered Heart Tissue
AU - Miyata, Daiki
AU - Masuda, Akari
AU - Kagawa, Gakuto
AU - Tani, Hidenori
AU - Takahashi, Hidetoshi
AU - Tohyama, Shugo
AU - Onoe, Hiroaki
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper describes an arrayed culture device for ring-shaped microscale engineered heart tissues (rEHT) to acquire data on the effect of electrical stimulation for contractile force (CF). Elastic pillars in millimeter-scale culture space were fabricated accurately with a 3D printed mold, enabling rEHT formation with small number of cells (1.0×105 cells). Thus, our device is suited to the acquisition of accurate and large numbers of experimental data. Our device was verified by confirming rEHT's response to electrical stimulation and CF measurement from the pillar deflection. We believe that our device would match to explore the electrical stimulus effect for heart tissue maturation with an AI-driven optimization algorithm.
AB - This paper describes an arrayed culture device for ring-shaped microscale engineered heart tissues (rEHT) to acquire data on the effect of electrical stimulation for contractile force (CF). Elastic pillars in millimeter-scale culture space were fabricated accurately with a 3D printed mold, enabling rEHT formation with small number of cells (1.0×105 cells). Thus, our device is suited to the acquisition of accurate and large numbers of experimental data. Our device was verified by confirming rEHT's response to electrical stimulation and CF measurement from the pillar deflection. We believe that our device would match to explore the electrical stimulus effect for heart tissue maturation with an AI-driven optimization algorithm.
KW - Cardiac tissue
KW - Contractile force
KW - Data acquisition
KW - Electrical stimulation
KW - Microscale fabrication
KW - hiPSCs
UR - https://www.scopus.com/pages/publications/105001660667
UR - https://www.scopus.com/pages/publications/105001660667#tab=citedBy
U2 - 10.1109/MEMS61431.2025.10917795
DO - 10.1109/MEMS61431.2025.10917795
M3 - Conference contribution
AN - SCOPUS:105001660667
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 83
EP - 86
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -