Automated solder inspection method by means of X-ray oblique computed tomography

Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed and reliable inspection technique for their solder joints. In this paper, we propose an automated X-ray inspection technique for BGA mounted substrate based on oblique computed tomography (OCT). Automated inspection consists of OCT capturing, position adjustment, bump extraction, character extraction and judgment. We proposed five characteristic features related to the bump shape. Moreover, by combining the characteristic features using artificial neural network, the condition of a solder bump was determined. In the experiments, we evaluate these techniques using actual BGA-mounted substrate. As a result, the correct rate of judgment reached 99.7%, which shows the clearly indicates that our method may be useful in the practice.

本文言語English
ホスト出版物のタイトル2007 IEEE International Conference on Image Processing, ICIP 2007 Proceedings
出版社IEEE Computer Society
5
ISBN(印刷版)1424414377, 9781424414376
DOI
出版ステータスPublished - 01-01-2007
外部発表はい
イベント14th IEEE International Conference on Image Processing, ICIP 2007 - San Antonio, TX, United States
継続期間: 16-09-200719-09-2007

Other

Other14th IEEE International Conference on Image Processing, ICIP 2007
国/地域United States
CitySan Antonio, TX
Period16-09-0719-09-07

All Science Journal Classification (ASJC) codes

  • 工学(全般)

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