TY - GEN
T1 - Development of an automated X-ray inspection method for microsolder bumps
AU - Teramoto, Atsushi
AU - Murakoshi, Takayuki
AU - Tsuzaka, Masatoshi
AU - Fujita, Hiroshi
PY - 2005
Y1 - 2005
N2 - BOA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for micro-solder bumps using an X-ray image. The thickness, area, volume, and void of the solder bumps were automatically inspected by this method. We introduced some correction techniques to reduce the effects of variation in the X-ray intensity and the spatial non-uniformity in the image. In this experiment, we evaluated accuracy and repeatability. The results demonstrated that the accuracy and repeatability met the requirement for online inspection. In conclusion, our automated method for inspecting micro-solder bumps may be useful in practice.
AB - BOA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for micro-solder bumps using an X-ray image. The thickness, area, volume, and void of the solder bumps were automatically inspected by this method. We introduced some correction techniques to reduce the effects of variation in the X-ray intensity and the spatial non-uniformity in the image. In this experiment, we evaluated accuracy and repeatability. The results demonstrated that the accuracy and repeatability met the requirement for online inspection. In conclusion, our automated method for inspecting micro-solder bumps may be useful in practice.
UR - http://www.scopus.com/inward/record.url?scp=33847259641&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33847259641&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2005.1598229
DO - 10.1109/EMAP.2005.1598229
M3 - Conference contribution
AN - SCOPUS:33847259641
SN - 1424401070
SN - 9781424401079
T3 - Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
SP - 21
EP - 26
BT - Proceedings - EMAP 2005
T2 - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Y2 - 11 December 2005 through 14 December 2005
ER -