Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method

Atsushi Teramoto, Isao Horiba

研究成果: Article査読

4 被引用数 (Scopus)

抄録

With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.

本文言語English
ページ(範囲)68-71
ページ数4
ジャーナルJournal of Japan Institute of Electronics Packaging
4
1
DOI
出版ステータスPublished - 1998
外部発表はい

All Science Journal Classification (ASJC) codes

  • 電子工学および電気工学

フィンガープリント

「Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル