High precision chemical mechanical polishing of highly-boron-doped Si wafer used for epitaxial substrate

Engineering

• Si Wafer 100%
• Chemical Mechanical Polishing 100%
• Boron Concentration 60%
• Amine System 40%
• Smooth Surface 20%
• Mechanical Stress 20%
• Polishing Pad 20%
• Polishing Slurry 20%
• Crystal Structure 20%
• Surface Waviness 20%
• Mechanical Action 20%
• Silicon Substrate 20%
• Microhardness 20%

Keyphrases

• Boron-doped 100%
• Amine System 40%
• Epitaxial Wafers 20%
• Silicon Crystal 20%

Material Science

• Silicon Substrate 16%