High Speed and High Precision Solder Bump Inspection Method Using X-ray Fluoroscopy

Atsushi Teramoto, Takayuki Murakoshi, Isao Horiba

研究成果: Article査読

3 被引用数 (Scopus)

抄録

This paper proposes a technique to inspect the bump height, area and volume of solder bump using X-ray fluoroscopy. Since X-ray fluoroscopy can acquire the 2-dimensional signal proportional to the thickness of a solder, it is expectable to measure a solder bump with high precision and at high speed. We introduced some image processing method to correct unevenness of image. Furthermore we introduced X-ray monitor in order to decrease the effect of X-ray fluctuation. As a result, fluctuation decrease more than 50% than without X-ray monitor. By compare to the optical measurement method, this method shows advantageous result at the viewpoint of bump coverage area and inspection speed.

本文言語English
ページ(範囲)652-658
ページ数7
ジャーナルIEEJ Transactions on Industry Applications
125
6
DOI
出版ステータスPublished - 01-09-2005
外部発表はい

All Science Journal Classification (ASJC) codes

  • 産業および生産工学
  • 電子工学および電気工学

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